JPH0544839B2 - - Google Patents
Info
- Publication number
- JPH0544839B2 JPH0544839B2 JP59031472A JP3147284A JPH0544839B2 JP H0544839 B2 JPH0544839 B2 JP H0544839B2 JP 59031472 A JP59031472 A JP 59031472A JP 3147284 A JP3147284 A JP 3147284A JP H0544839 B2 JPH0544839 B2 JP H0544839B2
- Authority
- JP
- Japan
- Prior art keywords
- tungsten
- alumina
- layer
- glass
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 38
- 229910052721 tungsten Inorganic materials 0.000 claims description 35
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 35
- 239000010937 tungsten Substances 0.000 claims description 35
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 33
- 239000011521 glass Substances 0.000 claims description 25
- 239000000945 filler Substances 0.000 claims description 12
- 229910000510 noble metal Inorganic materials 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 3
- 239000011231 conductive filler Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 53
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 21
- 239000000758 substrate Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 229910052697 platinum Inorganic materials 0.000 description 8
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 7
- 229910052707 ruthenium Inorganic materials 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 230000008018 melting Effects 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000009966 trimming Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59031472A JPS60176297A (ja) | 1984-02-23 | 1984-02-23 | ハイブリツドｉｃ用多層基板 |
| KR1019840005623A KR900004379B1 (ko) | 1983-09-16 | 1984-09-15 | 세라믹 다층기판 및 그 제조방법 |
| DE19843434449 DE3434449A1 (de) | 1983-09-16 | 1984-09-17 | Keramisches mehrschichtsubstrat und verfahren zu seiner herstellung |
| GB08423483A GB2149222B (en) | 1983-09-16 | 1984-09-17 | Multilatered ceramic substrate and method of making the same |
| US06/898,892 US4732798A (en) | 1983-09-16 | 1986-08-21 | Multilayer ceramic substrate and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59031472A JPS60176297A (ja) | 1984-02-23 | 1984-02-23 | ハイブリツドｉｃ用多層基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60176297A JPS60176297A (ja) | 1985-09-10 |
| JPH0544839B2 true JPH0544839B2 (en]) | 1993-07-07 |
Family
ID=12332202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59031472A Granted JPS60176297A (ja) | 1983-09-16 | 1984-02-23 | ハイブリツドｉｃ用多層基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60176297A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714105B2 (ja) * | 1986-05-19 | 1995-02-15 | 日本電装株式会社 | 混成集積回路基板及びその製造方法 |
-
1984
- 1984-02-23 JP JP59031472A patent/JPS60176297A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60176297A (ja) | 1985-09-10 |
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